展商名称：深圳芯泉半导体材料有限公司

英文名称：Sequameta Semiconductor Materials Co,.Ltd

展位号：9A23

产品/方案：‌主攻先进封装关键材料，如液态环氧塑封料(LMC)、各向异性导电胶(ACP)及光模块导热凝胶，致力于高端材料国产化。

公司地址：广东省深圳市宝安区福永街道龙王庙路1号606

公司介绍：

深圳芯泉半导体由中科院深圳先进电子材料国际创新研究院孵化，专注先进封装关键材料国产化，主营2.5D/CoWoS用液态环氧塑封料LMC、3D HBM模塑底部填充胶MUF、RFID用ACP导电胶及800G+光模块导热凝胶。
依托研究院二十载技术积淀，公司配备热学、力学、显微与失效分析实验室，配套2.5D/3D晶圆封装验证产线，建成研产销检服一体化团队，可为先进封装、RFID、光模块客户提供定制化服务。

英文介绍：

Sequameta Semiconductor Materials Co., Ltd., incubated by the Shenzhen Institute of Advanced Electronic Materials (SIEM), Chinese Academy of Sciences, focuses on the R&D and production of critical materials for advanced semiconductor packaging. The company's core product portfolio covers Liquid Molding Compound (LMC) for 2.5D/CoWoS packaging, Molding Underfill (MUF) for 3D HBM, Anisotropic Conductive Paste (ACP) for RFID, and Thermal Conductive Gels for 800G+ optical modules.
Leveraging over two decades of technical expertise accumulated at SIEM, the company operates fully equipped laboratories for thermal, mechanical, microscopic, and failure analysis, along with a 2.5D/3D wafer-level packaging pilot verification line. It has established an integrated team encompassing R&D, manufacturing, sales, quality inspection, and after-sales service. The company provides rapid custom material development services for customers in the advanced packaging, RFID, and high-speed optical module industries, as well as comprehensive supporting technical solutions.