展商名称：深圳芯泉半导体材料有限公司

英文名称：Sequameta Semiconductor Materials Co,.Ltd

展位号：9A23

产品/技术：根据RFID inlay客户最新技术需求，供应可同时满足RFID inlay不同芯片、不同基材、不同bonding设备、不同固化温度的ACP胶水。严格按照集成电路行业质量标准建立品质控制体系和系统，实现ACP全流程可追溯、可受控，为RFID客户持续供应高质、稳定的ACP产品以及良好的技术服务

应用领域：用于芯片或电子元器件电路连接和封装的导电粘合剂，具有单向导电（垂直性导通、水平不导通）及机械粘接固定的功能，可用于RFID、Micro LED、显示面板、软硬板互连、脑机接口/ 高密度电极互连等领域

公司地址：广东省深圳市宝安区福永街道龙王庙路1号606

公司介绍：

深圳芯泉半导体由中科院深圳先进电子材料国际创新研究院孵化，专注先进封装关键材料国产化，主营2.5D/CoWoS用液态环氧塑封料LMC、3D HBM模塑底部填充胶MUF、RFID用ACP导电胶及800G+光模块导热凝胶。
依托研究院二十载技术积淀，公司配备热学、力学、显微与失效分析实验室，配套2.5D/3D晶圆封装验证产线，建成研产销检服一体化团队，可为先进封装、RFID、光模块客户提供定制化服务。

英文介绍：

Sequameta Semiconductor Materials Co., Ltd., incubated by the Shenzhen Institute of Advanced Electronic Materials (SIEM), Chinese Academy of Sciences, focuses on the R&D and production of critical materials for advanced semiconductor packaging. The company's core product portfolio covers Liquid Molding Compound (LMC) for 2.5D/CoWoS packaging, Molding Underfill (MUF) for 3D HBM, Anisotropic Conductive Paste (ACP) for RFID, and Thermal Conductive Gels for 800G+ optical modules.
Leveraging over two decades of technical expertise accumulated at SIEM, the company operates fully equipped laboratories for thermal, mechanical, microscopic, and failure analysis, along with a 2.5D/3D wafer-level packaging pilot verification line. It has established an integrated team encompassing R&D, manufacturing, sales, quality inspection, and after-sales service. The company provides rapid custom material development services for customers in the advanced packaging, RFID, and high-speed optical module industries, as well as comprehensive supporting technical solutions.