展商名称：德邦（昆山）材料有限公司

英文名称：Darbond（Kunshan）Material Co., Ltd.

展位号：12C53-2

产品/方案：导热以及电磁屏蔽材料解决方案。

公司地址：苏州市

公司介绍：

德邦科技股份有限公司（688035）2003年成立，2022年科创板上市，是国家级高新技术企业、专精特新重点小巨人与制造业单项冠军企业。公司主营高端电子封装功能性高分子材料，业务覆盖集成电路、智能终端、新能源、高端装备四大领域，产品涵盖粘接、导热、屏蔽、防护等核心材料。依托自主研发核心技术，公司打破海外技术垄断，实现关键材料国产替代，配套国内外行业头部客户。

英文介绍：

Darbond Technology Co., Ltd. (Stock Code: 688035), established in 2003 and listed on the STAR Market in 2022, is a national high-tech enterprise, key specialized and sophisticated giant enterprise, and national manufacturing single champion in China. The company specializes in the R&D, production and sales of high-end functional polymer materials for electronic packaging. Its business covers four core fields: integrated circuits, smart terminals, new energy and high-end equipment, with core products including bonding materials, thermal conductive materials, electromagnetic shielding materials and protective materials. With independent innovation capabilities, Darbond has broken overseas technological monopolies and realized domestic substitution of core electronic materials, serving numerous leading domestic and foreign enterprises in the industry. The company has built a complete system covering independent research and development, standardized production and professional technical services. It continuously optimizes and upgrades core technologies in advanced electronic packaging and thermal management. Committed to forging a world-class brand in high-end electronic materials, Darbond keeps empowering the technological innovation and high-quality upgrading of the global high-end manufacturing and new information technology industries, and strives to enhance its core competitiveness in the global new material market.